Physical

Socket	AMD Socket AM4
Foundry	TSMC
Process Size	7 nm
Transistors	7,600 million
Die Size	2x 74 mm²
I/O Process Size	12 nm
I/O Die Size	124 mm²
Package	µOPGA-1331
tCaseMax	95°C

Processor

Market	Desktop
Production Status	Active
Release Date	Jul 7th, 2019
Launch Price	$499
Part	100-000000023 100-100000023BOX 100-100000023MPK

Performance

Frequency	3.8 GHz
Turbo Clock	up to 4.6 GHz
Base Clock	100 MHz
Multiplier	38.0x
Multiplier Unlocked	Yes
TDP	105 W
FP32	2,649.6 GFLOPS

Architecture

Codename	Matisse
Generation	Ryzen 9 (Zen 2 (Matisse))
Memory Support	DDR4
Rated Speed	3200 MT/s
Memory Bus	Dual-channel
ECC Memory	No
PCI-Express	Gen 4, 24 Lanes (CPU only)
Chipsets	A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

Core Config

Số luồng	12
Số lỗi	24
SMP CPUs	1
Integrated Graphics	N/A

Cache

Cache L1	64 KB (per core)
Cache L2	512 KB (per core)
Cache L3	64 MB